Publications


  1. “Preparation of BiCaSrCuO Specimens for High-Resolution Transmission Electron Microscopy,”  M. Powers, K. Fortunati, M. Fendorf, C.P. Burmester and R. Gronsky, Proceedings of the Electron Microscopy Society of America:  Forty-Seventh Annual Meeting, G.W. Bailey, Ed., San Francisco Press, San Francisco, pp. 714-715, 1989.
  2. “Preparation of YBaCuO SuperConductors for Transmission Electron Microscopy,”  M. Powers, Proceedings of the 12th International Congress for Electron Microscopy, G.W. Bailey, Ed., San Francisco Press, San Francisco, pp. 66-67, 1990.
  3. “A Quick, Simple Method for the Determination of Gold Concentration in Electroplating Solutions by High Performance Liquid Chromatography,” M. Powers, F. Hoppe and J. Gannotti, Plating and Surface Finishing, pp. 76-78, November 1991.
  4. “Thin Film Ag/YBCO Multistructures for Metal Contact Applications,” M. Powers, R. Gronsky and J. Washburn, Mat. Res. Soc. Vol. 275 Layered Superconductors:  Fabrication, Properties and Applications, Materials Research Society, Pittsburgh, pp. 825-830, 1992.
  5. “High-Resolution Transmission Electron Microscopy Study of Ag/YBCO for Metal Contact Applications,” M. Powers, M.S. Thesis, University of Californaia, Berkeley, 1992.
  6. “The Effect of Interfacial Structure on Contact Resistsivity in Ag/YBCO Thin Film Junctions,” M. Powers, Proceedings of the American Institute of Chemical Engineers 1994 Meeting, American Institute of Chemical Engineers, New York, NY  1994.
  7. “Preparation of Oxide Superconductor Specimens for TEM Examination,” M. Powers, M. Fendorf and R. Gronsky, Microscopy Research and Technique, 30, pp. 167-180, 1995.
  8. “Synergy 3000 CCS:  A New Precision Cleaning Agent,” M. Powers, Proceedings of the International CFC and Halon Alternatives Conference, Alliance for Responsible Atmospheric Policy, Washington, D.C., pp. 738-744, 1995.
  9. “1mm Connector Requires a New Paradigm for Design and Fabrication,” M. Powers and K. Howell, Proceedings of the Hewlett-Packard MICRO Mechanics, Machining and Miniturization Conference, Hewlett-Packard internal publication, Palo Alto, CA, 1996.
  10. “Active Metal Brazing for Ceramic-to-Metal Joining,” M. Powers, Proceedings of the International Systems Packaging Symposium, International Microelectronics and Packaging Society, Reston, VA, 1997.
  11. “Active Metal Brazing for Electronic Package Assembly,” M. Powers, Joining of Advanced and Specialty Materials, M. Singh, J.E. Indacochea and D. Hauser, Eds., American Society of Metals International, Materials Park, OH, pp. 63-66, 1998.
  12. “Precision Glass-to-Metal Seals for High Frequency Microwave Applications,” M. Powers, Advanced Brazing and Soldering Technologies, American Welding Society, Miami, FL, pp. 296-303, 2000.
  13. “A Surface Mount Coaxial Connector for RF/Microwave Applications,” M. Powers, in Joining of Advanced and Specialty Materials III, M. Singh, J.E. Indacochea and J.N. DuPont, American Society for Metals International, Materials Park, OH, 2001.
  14. “High Frequency (DC to 50 GHz) Hermetic Integral Coaxial Connector”, M. Powers, P. Cassanego and K. Wong in Research Disclosure, Kenneth Mason Publications Ltd, Westbourne, England, No. 446, pp. 994-997, 2001.
  15. “Optimization of Hysteresis in Ni-Fe Alloy for High Frequency Electronics Applications”, M. Powers, in Processing and Fabrication of Advanced Materials X, T.S. Srivatsan and R.A. Varin, Eds., American Society for Metals International, Materials Park, OH, pp. 92-109, 2002.
  16. “Heat Treatment of Cu-Be Components for High Frequency Coaxial Connector Assemblies - A University/Industry Design Project Collaboration”, J. Shackelford and M. Powers, in the National Educators' Workshop 2002: Standard Experiments in Engineering, Materials Science, and Technology, E.J. Prior, J.A. Jacobs and W.R. Chung, Eds., National Aeronautics and Space Administration, Hampton, VA, pp. 133-142, 2003.
  17. “Room Temperature Soldering with Nanostructured Foils”, J. Wang, E. Besnoin, A. Duckham, S. J. Spey, M. E. Reiss, O. M. Knio, M. Powers, M. Whitener, and T. P. Weihs, Applied Physics Letters, Volume 83, Issue 19, pp. 3987-3989, 2003.
  18. “Room Temperature Lead-Free Soldering of Microelectronic Components using a Local Heat Source,” J.P. Levin, T.R. Rude, J. Subramanian, E. Besnoin, T. P. Weihs, O.M. Knio, D. Van Heerden, M. Powers and C. D. Enns, in Joining of Advanced and Specialty Materials VII, T.J. Lienert, K.S. Weil, Y.N. Zhou, R.W. Smith and M. Powers, Eds., American Society for Metals International, Materials Park, OH, 2005.
  19. “Lead-Free Soldering of a Hybrid Microcircuit Package Assembly: A University-Industry Design Project Collaboration,” M. Powers, J.F. Shackelford, J.R. Groza, R. Bramlett, F. De Martino, S. Fukumoto, W.D. Hunting, S. Khalsa, A. Liu, C. Merrill, J. Tao and J. Yamanaga, in Joining of Advanced and Specialty Materials VII, T.J. Lienert, K.S. Weil, Y.N. Zhou, R.W. Smith and M. Powers, Eds., American Society for Metals International, Materials Park, OH, 2005.
  20. “Hermetic Sealing of Microelectronics Packages Using a Room Temperature Soldering Process,” T. Rude, J. Subramanian, J. Levin, D. Van Heerden, O. Knio and M.Powers, in Proc. 38th IMAPS International Symposium on Microelectronics, Philadelphia, PA, September 25-29, 2005.
  21. “Room Temperature Soldering of Connectors to PCB Using Reactive Multilayer Foils,” J. Levin, J. Subramanian, T. Rude, O. Knio, M. Powers and C. Enns, in Proc. 38th IMAPS International Symposium on Microelectronics, Philadelphia, PA, September 25-29, 2005.
  22. “Room Temperature Hermetic Sealing of Microelectronic Packages with Nanoscale Multilayer Reactive Foils,” M. Powers, J. Subramanian, J. Levin, T. Rude, D. Van Heerden and O. Knio, in Joining of Monolithic Structures and Components, C. Robino, M. Walp and T.J. Lienert, Eds., Minerals, Metals and Materials Society (TMS) Publications, Warrendale, PA, 2005.
  23. “Hermetic Glass-to-Aluminum Seals for RF Packaging Applications: A University-Industry Design Project Collaboration,” M. Powers, J.F. Shackelford, S. Sen, R.R. Cheng, P. Jain, M.J. Kuffel, A.J. Norris, T.J. Siliznoff, M. J. Tang, T.B. Tran and D.S. Yip, in Proceedings of the 3rd International Brazing and Soldering Conference, F.M. Hosking, J.J. Stephens and J.E. Indacochea, Eds., American Society for Metals International, Materials Park, OH, 2006.
  24. “Room Temperature Device Attach with Reactive Multilayer Foils,” M. Powers, Z. He, J. Levin, J. Subramanian, D. Van Heerden, P. Cassanego, and R. Warner, in Joining of Advanced and Specialty Materials, V.L Acoof, T.J. Lienert and P.T. Vianco, Eds., American Society for Metals International, Materials Park, OH, 2006.
  25. “Bonding Processes,” M. Powers, S. Sen, T. Nguyentat, O. Knio and T. Weihs, in CRC Materials Processing Handbook, J. Groza, M.Powers, E. Lavernia and J.F. Shackelford, Eds., Talyor and Francis Group, New York, Chap. 21, 2007.
  26. “Comparative Characterization of Cr3+- and Cr6+-based Chromate Conversion Coatings on Al Substrates for Test and Measurement Instrumentation,” M. Powers, S. Sen, C. N. Cao, M. R. Fukui, D. Hok, F. Kuo, A. A. Maich, J. F. Merckling, J. T. Pham, N. J. Spada, E. G. Szkup, E. L. Vallejo, A. S. Williamson, F. Wu and J. D. Wu, Proceedings of the 2007 Materials Science and Technology Conference, American Society for Metals International, Materials Park, OH, pp. 43-54, 2007.
  27. “An Investigation of Hexavalent-Free Chromate Conversion Coatings for Test and Measurement Instrumentation,” M. Powers, Collected Proceedings of the TMS 2008 137th Annual Meeting & Exhibition, The Minerals, Metals & Materials Society, Warrendale, PA, pp. 295-300, 2008.
  28. “Feedback Controlled High Frequency Electrochemical Micromachining,” F.M. Ozkeskin, S.S. Sundarram, S. Allison, N.P. Hung, M. Powers, G. Strohm, L.A. Godinez and J.R. Mariquez, Proceedings of the 54th International Instrumentation Symposium, Instrument Society of America, Research Triangle Park, NC, 2008.
  29. “Pb-free Solder Assembly of a Printed Circuit Based Multi-Chip Module: A University-Industry Design Project Collaboration,” M. Powers, J.F. Shackelford, B. Chan, N. Dudley, J. Luhn, C. Lung and K. McNally, Proceedings of the 4th International Brazing and Soldering Conference, Anatol Rabinkin, Robin Gourley and Chuck Walker, editors, ASM International, Materials Park, OH, and The American Welding Society, Miami, FL, 2009, pp. 29-36.
  30. “High Frequency Electrochemical Micromachining,” N.P. Hung, S. Sundarram, V. Vasiraju and M. Powers, Proceedings of the SME Micro/Nano Manufacturing Conference, Minneapolis, Minnesota, April 2009.
  31. “Electrochemical Micromachining: A Case Study for Synergistic Industry-Academia International Collaboration,” N.P. Hung, S. Sundarram, F.M. Ozkerskin, M. Powers and J. Manriquez, AC2009-2502, Proceedings of the ASEE Annual Conference, Austin, Texas, June 2009.
  32. “Profile of Electrochemically Machined Microcomponents,” N.P. Hung, L. Viswanathan and M. Powers, Proceedings of the TMS 2011 140th Annual Meeting & Exhibition, Supplemental Proceedings: Volume 3, The Minerals, Metal & Materials Society, Warrendale, PA, pp. 325-332, 2011.
  33. “Joining of Advanced Aluminum-Graphite Composite,” N.P. Hung, M. Velamati, E. Aguilar, M.A. Garza-Castanon and M. Powers, Proceedings of the TMS 2011 140th Annual Meeting & Exhibition, Supplemental Proceedings: Volume 2, The Minerals, Metal & Materials Society, Warrendale, PA, pp. 805-812, 2011.
  34. “Effect of Gold Content on the Reliability of SnAgCu Solder Joints,” J. Pan, J. Silk, M. Powers and P. Hyland, Proceeding of IPC Printed Circuits Expo, APEX and the Designers Summit 2011, Las Vegas, NV, Apr. 12-14, 2011.
  35. “Effect of Gold Content on the Reliability of SnAgCu Solder Joints,” J. Pan, J. Silk, M. Powers and P. Hyland, IEEE Transactions on Components, Packaging and Manufacturing Technology, 1, 10, pp, 1662-1669, 2011.
  36. “Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints under Isothermal Aging,” M. Powers, J. Pan, J. Silk and P. Hyland, Journal of Electronic Materials, 41, 2, pp. 224-231, 2012.
  37. “Laser and Resistance Joining of Aluminum-Graphite Composite,” N.P. Hung, M. Velamati, E. Aguilar, M.A. Garza-Castanon and M. Powers, Journal of Materials Processing Technology, 212, pp. 2549-2557, 2012.
  38. “The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish,” J. Silk, J. Pan and M. Powers, SMT Magazine, Volume 27, Number 7, pp. 16-30, 2012.
  39. “The Effect of Ni Content on Lateral Diffusion of Alloyed Au-Ni-AuGe Ohmic Contacts in GaAs-AlGaAs-InGaAs pHEMPT Structures,” M. Powers, J. Staroba and C. Cheng, Proceedings of the CS ManTech Conference, Denver, CO, pp. 119-122, May 19-22, 2014.
  40. “High Strength Materials for High Temperature Processing: A University-Industry Design Project Collaboration,” M. Powers et al., Proceedings of the 4th International Brazing and Soldering Conference,  American Welding Society, Miami, FL, 2015.