Lead Free Soldering

Traditional electronic component designs, including the equipment and processes used to produce them were based on the properties of eutectic Sn-Pb solder, which the industry used since its beginnings over 75 years ago. In order to facilitate the conversion to Pb-free soldering technology required by international law, the electronics industry has struggled to reduce the number of reliable Pb-free solder alloys to only a few and develop processes and standards consistent with these new alloys. Considerable research has been conducted on Pb-free solders regarding joint strength, reliability and their interaction with various surface finishes, especially Au.

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Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging